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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9985390 B1

PDFFull Text
Date of Patent:
May. 29, 2018

Filed:

Aug. 10, 2017

Electrically groundable support surface and related methods

Applicant:

Newpark Mats & Integrated Services Llc, The Woodlands, TX (US);

Inventors:

James Kerwin McDowell, Lafayette, LA (US);

Kenneth Edward Durio, Arnaudville, LA (US);

Assignee:

Newpark Mats & Integrated Services LLC, The Woodlands, TX (US);

Attorneys:

E. Randall Smith

E. Randall Smith, P.C.

Primary Examiner:

Gary Paumen

Int. Cl.
CPC ...
H01R 4/64 (2006.01); E01C 5/00 (2006.01); E01C 9/00 (2006.01); H01R 13/648 (2006.01); E01C 11/24 (2006.01); E01C 9/08 (2006.01); H05F 3/02 (2006.01); H02B 13/025 (2006.01); E01C 5/22 (2006.01); E21B 41/00 (2006.01); E04B 5/02 (2006.01); E04H 3/12 (2006.01);
U.S. Cl.
CPC ...
H01R 13/648 (2013.01); E01C 5/005 (2013.01); E01C 5/22 (2013.01); E01C 9/08 (2013.01); E01C 11/24 (2013.01); E04B 5/02 (2013.01); E04H 3/126 (2013.01); E21B 41/0021 (2013.01); H02B 13/025 (2013.01); H05F 3/025 (2013.01); E01C 2201/12 (2013.01); Y10T 29/49117 (2015.01);
Abstract

An electrically groundable support surface includes a lower portion configured to be deployed on or near the surface of the earth. An electrically-conductive cover portion constructed at least partially of electrically-conductive material is configured to extend at least partially across the top surface of the lower portion and is electrically groundable to the earth. At least one electrically-conductive interface is configured to facilitate electrical connection of the support surface to another electrically-conductive component.

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