The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 29, 2018

Filed:

May. 05, 2017
Applicant:

Tc1 Llc, St. Paul, MN (US);

Inventor:

William V. Hodges, Tracy, CA (US);

Assignee:

TC1 LLC, St. Paul, MN (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01R 13/70 (2006.01); H01R 13/193 (2006.01); H01R 13/22 (2006.01); H01R 43/26 (2006.01); H01R 13/52 (2006.01); A61M 1/10 (2006.01);
U.S. Cl.
CPC ...
H01R 13/193 (2013.01); A61M 1/1008 (2014.02); H01R 13/22 (2013.01); H01R 13/5224 (2013.01); H01R 43/26 (2013.01); A61M 2205/8206 (2013.01); A61M 2207/00 (2013.01); H01R 2201/12 (2013.01);
Abstract

An implantable connector utilizing having improved electrical and mechanical properties is described herein. In one aspect, the implantable connector utilizes electrical contact pins fabricated from a corrosion resistant metal alloy, such as platinum-iridium, that engage longitudinally and include one or more urging members on a proximal portion of the pin so as to provide at least a desired contact force between conductively coupled pins. Such a configuration allows contact between contact pins to be maintained in applications where the connector may be subject to movement and further allows for reduced resistance so as to allow transmission of voltages and current associated with higher powered implanted devices. In some embodiments, the urging member is defined as a helical cut potion in one or both electrical contacts. Methods of use and manufacture of such connectors are also provided herein.


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