The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 29, 2018

Filed:

Aug. 08, 2016
Applicants:

Lite-on Opto Technology (Changzhou) Co., Ltd., Changzhou, Jiangsu, CN;

Lite-on Technology Corporation, Taipei, TW;

Inventors:

Kuo-Ming Chiu, New Taipei, TW;

Meng-Sung Chou, New Taipei, TW;

Hung-Jui Chen, New Taipei, TW;

Han-Hsing Peng, New Taipei, TW;

Assignees:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 33/62 (2010.01); H01L 33/60 (2010.01); H01L 33/54 (2010.01); H01L 33/48 (2010.01); H01L 33/58 (2010.01);
U.S. Cl.
CPC ...
H01L 33/62 (2013.01); H01L 33/486 (2013.01); H01L 33/58 (2013.01); H01L 33/60 (2013.01);
Abstract

An LED package structure includes a ceramic substrate, a ceramic board, a light-emitting unit, a first adhesive layer, a second adhesive layer, and a cover. The ceramic board having a thru-hole is disposed on the ceramic substrate. The light-emitting unit is disposed on the ceramic substrate and is arranged in the thru-hole of the ceramic board. The first and second adhesive layers are disposed on the ceramic board, and the second adhesive layer covers the first adhesive layer. The cover is fixed on the ceramic board by the first and second adhesive layers. Thus, the shearing force of the LED package structure of the instant disclosure is increased by having the first and second adhesive layers, which are connected to each other.


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