The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 29, 2018
Filed:
May. 18, 2016
Applicant:
Nichia Corporation, Anan-shi, Tokushima, JP;
Inventor:
Ryosuke Wakaki, Tokushima, JP;
Assignee:
NICHIA CORPORATION, Anan-Shi, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 33/00 (2010.01); H01L 33/62 (2010.01); H05K 1/11 (2006.01); H02K 3/34 (2006.01); H05K 3/34 (2006.01);
U.S. Cl.
CPC ...
H01L 33/62 (2013.01); H05K 1/111 (2013.01); H05K 3/3442 (2013.01); H05K 2201/09736 (2013.01); H05K 2201/09745 (2013.01); H05K 2201/10636 (2013.01); Y02P 70/611 (2015.11);
Abstract
A semiconductor device includes a mounting substrate with a land having a first surface and a second surface higher than the first surface, a side-emission type light emitting device including an external connecting terminal disposed on the first surface, and a bonding member disposed at least on the second surface to bond the external connecting terminal and the land.