The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 29, 2018

Filed:

Oct. 21, 2016
Applicant:

Toyoda Gosei Co., Ltd., Kiyosu, JP;

Inventors:

Yosuke Tsuchiya, Kiyosu, JP;

Hiroyuki Tajima, Kiyosu, JP;

Toshiaki Mori, Kiyosu, JP;

Assignee:

TOYODA GOSEI CO., LTD., Kiyosu-Shi, Aichi-Ken, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 33/60 (2010.01); H01L 33/00 (2010.01); H01L 33/50 (2010.01); H01L 33/56 (2010.01); H01L 33/62 (2010.01);
U.S. Cl.
CPC ...
H01L 33/60 (2013.01); H01L 33/0095 (2013.01); H01L 33/502 (2013.01); H01L 33/56 (2013.01); H01L 33/62 (2013.01); H01L 2933/005 (2013.01); H01L 2933/0041 (2013.01); H01L 2933/0058 (2013.01); H01L 2933/0066 (2013.01);
Abstract

A method of manufacturing a light emitting device, includes: mounting an LED chip on a substrate; forming a translucent sealing layer for sealing the LED chip; forming a protective layer on the sealing layer; forming a groove, which penetrates the substrate and the sealing layer, using a blade from a side opposite to the side of the substrate mounted with the LED chip, the groove being formed to extend to a lower surface or an inside of the protective layer; filling the groove with a reflector material; and removing and separating a portion of the protective layer in which at least the groove is formed, wherein the blade has a shape tapered toward an edge.


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