The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 29, 2018

Filed:

Feb. 14, 2017
Applicant:

The Charles Stark Draper Laboratory, Inc., Cambridge, MA (US);

Inventors:

Tirunelveli Sriram, Acton, MA (US);

Brian Smith, Cambridge, MA (US);

Bryan Mclaughlin, Cambridge, MA (US);

John Lachapelle, Princeton, MA (US);

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01K 3/10 (2006.01); H01L 23/00 (2006.01); H01L 23/13 (2006.01); H01L 25/00 (2006.01); H01L 25/065 (2006.01); H01L 23/31 (2006.01); H01L 23/498 (2006.01); A61N 1/05 (2006.01); A61B 5/04 (2006.01); A61N 1/375 (2006.01);
U.S. Cl.
CPC ...
H01L 24/83 (2013.01); A61B 5/04001 (2013.01); A61N 1/0551 (2013.01); A61N 1/375 (2013.01); H01L 23/13 (2013.01); H01L 23/3107 (2013.01); H01L 23/4985 (2013.01); H01L 23/49827 (2013.01); H01L 24/45 (2013.01); H01L 24/85 (2013.01); H01L 25/065 (2013.01); H01L 25/50 (2013.01); H01L 2224/45169 (2013.01); H01L 2224/4811 (2013.01); H01L 2224/48496 (2013.01); H01L 2224/83007 (2013.01); H01L 2224/83345 (2013.01); H01L 2224/83365 (2013.01); H01L 2224/83385 (2013.01); H01L 2224/83986 (2013.01); H01L 2224/85007 (2013.01); H01L 2224/85345 (2013.01); H01L 2224/85385 (2013.01); H01L 2224/85986 (2013.01);
Abstract

A method for bonding a hermetic module to an electrode array including the steps of: providing the electrode array having a flexible substrate with a top surface and a bottom surface and including a plurality of pads in the top surface of the substrate; attaching the hermetic module to the bottom surface of the electrode array, the hermetic module having a plurality of bond-pads wherein each bond-pad is adjacent to the bottom surface of the electrode array and aligns with a respective pad; drill holes through each pad to the corresponding bond-pad; filling each hole with biocompatible conductive ink; forming a rivet on the biocompatible conductive ink over each pad; and overmolding the electrode array with a moisture barrier material.


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