The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 29, 2018

Filed:

Dec. 07, 2012
Applicant:

Abb Technology Ltd, Zürich, CH;

Inventors:

Olle Ekwall, Ludvika, SE;

Erik Doré, Ludvika, SE;

Franc Dugal, Benglen, CH;

Raffael Schnell, Seon, CH;

Assignee:

ABB SCHWEIZ AG, Baden, CH;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/40 (2006.01); H01L 25/07 (2006.01); H01L 25/16 (2006.01); H02M 7/00 (2006.01); H05K 7/20 (2006.01); H01L 23/473 (2006.01); H01L 23/00 (2006.01); H01L 23/367 (2006.01); H01L 25/11 (2006.01);
U.S. Cl.
CPC ...
H01L 23/4012 (2013.01); H01L 23/3675 (2013.01); H01L 23/4006 (2013.01); H01L 23/473 (2013.01); H01L 24/72 (2013.01); H01L 25/071 (2013.01); H01L 25/074 (2013.01); H01L 25/117 (2013.01); H01L 25/16 (2013.01); H02M 7/003 (2013.01); H05K 7/209 (2013.01); H01L 2023/4031 (2013.01); H01L 2023/4081 (2013.01); H01L 2023/4087 (2013.01); H01L 2924/1305 (2013.01); H01L 2924/13055 (2013.01);
Abstract

A semiconductor assembly includes a stack with a semiconductor module and a cooler, wherein the semiconductor module is provided in contact with the cooler. A clamping assembly is adapted to exert a force on the two sides of the stack. The stack is provided with a through hole between the two sides thereof and a part of the clamping assembly including an electrically conductive part which extends through the through hole of the stack. Thereby, a compact mechanical arrangement is provided while obtaining improved electrical properties, such as lower inductance and more even current distribution.


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