The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 29, 2018
Filed:
Feb. 23, 2017
Applicant:
Korea Electronics Technology Institute, Seongnam-si, Gyeonggi-do, KR;
Inventors:
Assignee:
KOREA ELECTRONICS TECHNOLOGY INSTITUTE, Seongnam-si, Gyeonggi-do, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/52 (2006.01); H01L 23/367 (2006.01); H01L 23/14 (2006.01); H01L 23/13 (2006.01); H01L 23/373 (2006.01); H01L 23/485 (2006.01); H01L 21/52 (2006.01); H01L 21/56 (2006.01);
U.S. Cl.
CPC ...
H01L 23/3675 (2013.01); H01L 21/52 (2013.01); H01L 21/56 (2013.01); H01L 23/13 (2013.01); H01L 23/142 (2013.01); H01L 23/3735 (2013.01); H01L 23/3736 (2013.01); H01L 23/485 (2013.01);
Abstract
Disclosed is a semiconductor package including: a base substrate provided with at least one cavity and made of a metallic material; at least one semiconductor chip mounted in the cavity; and a heat dissipating member arranged in a gap between an inner surface of the cavity and the semiconductor chip.