The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 29, 2018
Filed:
May. 04, 2017
Applicant:
Abb Schweiz Ag, Baden, CH;
Inventors:
Assignee:
ABB Schweiz AG, Baden, CH;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/29 (2006.01); H01L 23/06 (2006.01); H01L 29/739 (2006.01); H01L 23/31 (2006.01); H01L 23/051 (2006.01);
U.S. Cl.
CPC ...
H01L 23/29 (2013.01); H01L 23/06 (2013.01); H01L 23/3121 (2013.01); H01L 29/7393 (2013.01); H01L 23/051 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/48472 (2013.01); H01L 2224/8592 (2013.01); H01L 2924/1815 (2013.01);
Abstract
A power electronics module includes: a baseplate, a power semiconductor chip arranged on the baseplate, and an encapsulation structure arranged on the baseplate and configured to encapsulate the power semiconductor chip, wherein the encapsulation structure is an epoxy having an elastic modulus in a range of 1 to 20 Giga Pascal, GPa, at room temperature and a coefficient of thermal expansion less than 20 ppm/K.
Guillon, David. (2018). High voltage power electronics module for subsea applications under high hydrostatic pressure and temperature variations (U.S. Patent No. 9984948). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9984948
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile