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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9984930 B1

PDFFull Text
Date of Patent:
May. 29, 2018

Filed:

Jun. 28, 2016

Method for processing a carrier

Applicant:

Infineon Technologies Dresden Gmbh, Dresden, DE;

Inventors:

Stefan Tegen, Dresden, DE;

Marko Lemke, Dresden, DE;

Assignee:

INFINEON TECHNOLOGIES DRESDEN GMBH, Dresden, DE;

Attorney:

Viering Jentschura & Partner MBB

Primary Examiner:

Abdul Kalam

Int. Cl.
CPC ...
H01L 21/285 (2006.01); H01L 21/8234 (2006.01); H01L 21/8238 (2006.01); H01L 21/308 (2006.01); H01L 29/66 (2006.01); H01L 21/02 (2006.01); H01L 21/027 (2006.01); H01L 21/3065 (2006.01); H01L 21/84 (2006.01);
U.S. Cl.
CPC ...
H01L 21/823431 (2013.01); H01L 21/0223 (2013.01); H01L 21/0273 (2013.01); H01L 21/28506 (2013.01); H01L 21/308 (2013.01); H01L 21/3065 (2013.01); H01L 21/3081 (2013.01); H01L 21/3083 (2013.01); H01L 21/823437 (2013.01); H01L 21/823462 (2013.01); H01L 21/823821 (2013.01); H01L 29/66795 (2013.01); H01L 21/02255 (2013.01); H01L 21/845 (2013.01);
Abstract

A method for processing a carrier may include: forming a plurality of structure elements at least one of over and in a carrier, wherein at least two adjacent structure elements of the plurality of structure elements have a first distance between each other; depositing a first layer over the plurality of structure elements having a thickness which equals the first distance between the at least two adjacent structure elements; forming at least one additional layer over the first layer, wherein the at least one additional layer covers an exposed surface of the first layer; removing a portion of the at least one additional layer to expose the first layer partially; and partially removing the first layer, wherein at least one sidewall of the at least two adjacent structure elements is partially exposed.

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