The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 29, 2018

Filed:

Nov. 25, 2015
Applicant:

Horiba Stec, Co., Ltd., Kyoto-shi, Kyoto, JP;

Inventors:

Akihiro Taguchi, Kyoto, JP;

Masashi Hamada, Kyoto, JP;

Hidetaka Yada, Kyoto, JP;

Assignee:

HORIBA STEC, Co., Ltd., Kyoto-shi, Kyoto, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
F22D 5/30 (2006.01); F22B 1/28 (2006.01); F22D 5/34 (2006.01);
U.S. Cl.
CPC ...
F22D 5/30 (2013.01); F22B 1/285 (2013.01); F22D 5/34 (2013.01);
Abstract

The present invention makes it possible to reduce the size of a vaporization system by eliminating the need for conduits in the vaporization system, without it being necessary to form a flow path in order for a supply rate controller to be mounted inside a vaporizer, and is formed by a vaporizer that vaporizes a liquid material; a supply rate controller that controls a supply rate of the liquid material to the vaporizer; and a manifold block inside which an internal flow path is formed, and that has a device mounting surface on which both the vaporizer and the supply rate controller are mounted, wherein, as a result of the vaporizer and the supply rate controller being mounted on the device mounting surface, they are connected together via the flow path.


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