The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 29, 2018

Filed:

Dec. 14, 2012
Applicant:

Applied Materials, Inc., Santa Clara, CA (US);

Inventors:

Chien-Teh Kao, Sunnyvale, CA (US);

Hyman W. H. Lam, San Jose, CA (US);

Assignee:

APPLIED MATERIALS, INC., Santa Clara, CA (US);

Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C23C 16/00 (2006.01); H01L 21/00 (2006.01); C23C 16/455 (2006.01); H01J 37/32 (2006.01); C23C 16/44 (2006.01); C23C 16/509 (2006.01);
U.S. Cl.
CPC ...
C23C 16/455 (2013.01); C23C 16/4408 (2013.01); C23C 16/45565 (2013.01); C23C 16/45574 (2013.01); H01J 37/3244 (2013.01); H01J 37/32357 (2013.01); H01J 37/32449 (2013.01); C23C 16/5096 (2013.01);
Abstract

Apparatus for providing plasma to a process chamber may include an electrode; a first ground plate disposed beneath the electrode defining a cavity therebetween; an insulator disposed between the electrode and first ground plate to prevent direct contact therebetween; a second ground plate disposed beneath the first ground plate defining a first channel; a plurality of first through holes through the first ground plate to fluidly couple the channel and cavity; a first gas inlet coupled to the first channel; a third ground plate disposed beneath the second ground plate defining a second channel; a plurality of conduits through the ground plates to fluidly couple the cavity to an area beneath the third ground plate; a plurality of gas outlet holes through the third ground plate to fluidly couple the second channel to the area beneath the third ground plate; and a second gas inlet coupled to the second channel.


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