The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 29, 2018

Filed:

Dec. 19, 2014
Applicant:

Mitsubishi Materials Electronic Chemicals Co., Ltd., Akita, JP;

Inventor:

Kensuke Kageyama, Akita, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01B 1/02 (2006.01); C09D 5/24 (2006.01); C09D 11/52 (2014.01); C09J 9/02 (2006.01); C09J 11/00 (2006.01); C09J 201/00 (2006.01); C23C 18/16 (2006.01); C23C 18/31 (2006.01); C23C 18/44 (2006.01); H01B 1/22 (2006.01); C23C 18/42 (2006.01); C23C 18/52 (2006.01); C08J 3/12 (2006.01); C08K 9/10 (2006.01); C09D 163/00 (2006.01); C09J 11/06 (2006.01); C09J 11/08 (2006.01); C09J 7/00 (2018.01); C09J 11/04 (2006.01);
U.S. Cl.
CPC ...
C09D 5/24 (2013.01); C08J 3/128 (2013.01); C08K 9/10 (2013.01); C09D 7/40 (2018.01); C09D 7/63 (2018.01); C09D 7/65 (2018.01); C09D 7/69 (2018.01); C09D 7/70 (2018.01); C09D 11/52 (2013.01); C09D 163/00 (2013.01); C09J 7/00 (2013.01); C09J 9/02 (2013.01); C09J 11/00 (2013.01); C09J 11/04 (2013.01); C09J 11/06 (2013.01); C09J 11/08 (2013.01); C09J 201/00 (2013.01); C23C 18/16 (2013.01); C23C 18/165 (2013.01); C23C 18/1633 (2013.01); C23C 18/1641 (2013.01); C23C 18/31 (2013.01); C23C 18/42 (2013.01); C23C 18/44 (2013.01); C23C 18/52 (2013.01); H01B 1/02 (2013.01); H01B 1/22 (2013.01); C08J 2325/06 (2013.01); C08J 2333/00 (2013.01); C08J 2361/06 (2013.01); C08K 2201/001 (2013.01); C09J 2203/318 (2013.01);
Abstract

Provided are highly reliable silver-coated conductive particles, which are prevented from an occurrence of migration, the silver-coated conductive particles in which: a tin layer is formed on a surface of each spherical base particle, and a silver plating layer is formed on a surface of the tin layer, and a surface of the silver plating layer is coated with a water repellent layer: the water repellent layer includes an organic sulfur compound that is mainly composed of a sulfide compound or a surfactant such as polyoxyethylene ethers: and a molded body that is formed by pressing the silver-coated conductive particles at a pressure of 14.7 MPa has a contact angle with water of 125 degree or more.


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