The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 29, 2018
Filed:
Jan. 07, 2014
Applicant:
Toray Industries, Inc., Tokyo, JP;
Inventors:
Johnathan C Hughes, Tacoma, WA (US);
Hiroaki Sakata, Ehime, JP;
Assignee:
TORAY INDUSTRIES, INC., Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 27/38 (2006.01); B32B 27/26 (2006.01); B32B 27/04 (2006.01); C08J 5/24 (2006.01); C08G 59/38 (2006.01); C08G 59/40 (2006.01); C08L 63/00 (2006.01); C08G 59/14 (2006.01); C08G 59/32 (2006.01); C08G 59/68 (2006.01);
U.S. Cl.
CPC ...
C08G 59/1477 (2013.01); C08G 59/3227 (2013.01); C08G 59/38 (2013.01); C08G 59/4021 (2013.01); C08G 59/686 (2013.01); C08J 5/24 (2013.01); C08L 63/00 (2013.01); C08J 2363/00 (2013.01);
Abstract
An embodiment relates to a resin composition containing a tetraglycidyl amine; a bisphenol epoxy; a dicyandiamide; and an aromatic urea; wherein the tetraglycidyl amine has a EEW of 110 g/eq to 140 g/eq and is an amount of 30 to 60 PHR per 100 PHR of total epoxy resin in the resin composition; wherein the resin composition has a Tg of at least 160° C. when cured at 143° C. for 3 min and also maintains a Tg of greater than 160° C. when cured at 177 C for 1 min or longer.