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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9981424 B1

PDFFull Text
Expired
Date of Patent:
May. 29, 2018

Filed:

Mar. 07, 2013

Process for removing excess pasty material joining a plurality of substrates

Applicant:

Dow Global Technologies Llc, Midland, MI (US);

Inventors:

James R. Ogle, Rosharon, TX (US);

Jeremy J. Patt, Midland, MI (US);

Assignee:

DOW GLOBAL TECHNOLOGIES LLC, Midland, MI (US);

Attorney:

The Dobrusin Law Firm, P.C.

Primary Examiner:

Katelyn B Whatley

Int. Cl.
CPC ...
B08B 1/00 (2006.01); B29C 65/00 (2006.01); B28B 1/00 (2006.01); B28B 11/18 (2006.01); B29C 37/04 (2006.01); B26D 1/00 (2006.01);
U.S. Cl.
CPC ...
B29C 66/3262 (2013.01); B08B 1/005 (2013.01); B28B 1/002 (2013.01); B28B 11/18 (2013.01); B29C 37/04 (2013.01); B26D 2001/002 (2013.01); B26D 2001/006 (2013.01); B26D 2001/0053 (2013.01);
Abstract

A method comprising: a) contacting an article comprising one or more blades (), the one or more blades () having a leading edge () curved upward and separated into prongs () by one or more notches () in the one or more blades (), with two or more substrates () joined by a pasty material overflowing at one or more seams (), where the one or more notches () of the article straddle the one or more seams (); and b) moving the article or the substrates () such that the pasty material overflowing at the one or more seams () is removed.

Find Patent Forward Citations

Quick Actions:

Ogle, James. (2018). Process for removing excess pasty material joining a plurality of substrates (U.S. Patent No. 9981424). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9981424

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