The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 22, 2018

Filed:

Sep. 17, 2015
Applicant:

Denso Corporation, Kariya, Aichi-pref., JP;

Inventors:

Takashi Yoshimizu, Kariya, JP;

Yuuki Sanada, Kariya, JP;

Assignee:

DENSO CORPORATION, Kariya, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 7/20 (2006.01); H05K 7/14 (2006.01); H01L 23/498 (2006.01); H01L 23/31 (2006.01); H01L 23/053 (2006.01); H05K 1/18 (2006.01); H01L 23/10 (2006.01); H01G 2/06 (2006.01); H01G 2/10 (2006.01); H05K 1/11 (2006.01); H01L 23/367 (2006.01); H01G 2/08 (2006.01); H05K 1/02 (2006.01); H01L 23/473 (2006.01);
U.S. Cl.
CPC ...
H05K 7/1427 (2013.01); H01G 2/065 (2013.01); H01G 2/08 (2013.01); H01G 2/103 (2013.01); H01L 23/053 (2013.01); H01L 23/10 (2013.01); H01L 23/3121 (2013.01); H01L 23/3675 (2013.01); H01L 23/49827 (2013.01); H01L 23/49844 (2013.01); H05K 1/0203 (2013.01); H05K 1/115 (2013.01); H05K 1/181 (2013.01); H05K 2201/10015 (2013.01); H05K 2201/10166 (2013.01);
Abstract

An electronic device includes a circuit board with an insulating substrate, a wiring at the substrate, an electronic component mounted at the substrate and electrically connected to the wiring, at least one through hole through the substrate from one surface to an opposite surface of the one surface of the substrate, and a conductive member arranged at a surface of the through hole and electrically connected to the wiring; and further includes: a sealing resin; and a cap including an annular connection with a part connected to the substrate and a recess recessed from the annular connection. Furthermore, in the cap, at least a part of the connection is connected to the substrate, the cap being sealed integrally with the electronic component by the sealing resin while arranging a space communicating with the through hole; and a terminal is inserted into the through hole and electrically connected to the wiring.


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