The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 22, 2018
Filed:
Jun. 21, 2013
Applicant:
Kyocera Corporation, Kyoto-shi, Kyoto, JP;
Inventors:
Yoshio Ohashi, Satsumasendai, JP;
Kunihide Shikata, Kirishima, JP;
Assignee:
KYOCERA Corporation, Kyoto, JP;
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/03 (2006.01); H05K 1/09 (2006.01); H05K 1/18 (2006.01); H05K 3/38 (2006.01); C04B 37/02 (2006.01); H05K 1/11 (2006.01);
U.S. Cl.
CPC ...
H05K 1/181 (2013.01); C04B 37/025 (2013.01); H05K 1/0306 (2013.01); H05K 1/092 (2013.01); H05K 3/388 (2013.01); C04B 2237/10 (2013.01); C04B 2237/343 (2013.01); C04B 2237/407 (2013.01); C04B 2237/55 (2013.01); C04B 2237/59 (2013.01); C04B 2237/86 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/73265 (2013.01); H05K 1/111 (2013.01); H05K 2201/10462 (2013.01); H05K 2201/2063 (2013.01); Y02P 70/611 (2015.11);
Abstract
The circuit board includes a ceramic sintered body and a metal wiring layer provided on at least one primary surface thereof with a glass layer interposed therebetween, and when the cross section of the circuit board perpendicular to the primary surface of the ceramic sintered body is viewed, the ratio of the length of an interface between the glass layer and the metal wiring layer to a length of the glass layer in a direction along the primary surface is 1.25 to 1.80.