The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 22, 2018

Filed:

Jun. 24, 2015
Applicant:

Murata Manufacturing Co., Ltd., Nagaokakyo-shi, Kyoto-fu, JP;

Inventors:

Kuniaki Yosui, Nagaokakyo, JP;

Masahiro Ozawa, Nagaokakyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01H 47/00 (2006.01); H05K 1/16 (2006.01); H01L 23/498 (2006.01); H01G 4/40 (2006.01); H01G 2/06 (2006.01); H05K 3/46 (2006.01); H05K 1/03 (2006.01); H05K 1/11 (2006.01); H01F 17/00 (2006.01); H05K 3/38 (2006.01);
U.S. Cl.
CPC ...
H05K 1/162 (2013.01); H01G 2/06 (2013.01); H01G 4/40 (2013.01); H01L 23/49822 (2013.01); H05K 1/0313 (2013.01); H05K 1/111 (2013.01); H05K 1/115 (2013.01); H05K 1/165 (2013.01); H05K 3/4617 (2013.01); H01F 17/0006 (2013.01); H01L 2224/16225 (2013.01); H01L 2924/19105 (2013.01); H05K 3/383 (2013.01); H05K 3/4632 (2013.01); H05K 2201/0129 (2013.01); H05K 2201/0355 (2013.01); H05K 2201/096 (2013.01); H05K 2201/097 (2013.01); H05K 2201/09527 (2013.01); H05K 2201/09672 (2013.01); H05K 2203/0278 (2013.01); H05K 2203/0307 (2013.01);
Abstract

Sheets are laminated on each other and pressure bonded with fixtures from upper and lower directions of a lamination direction while being heated to produce a laminated circuit substrate including therein a capacitor and a coil. The capacitor is defined by a first conductor pattern and a second conductor pattern that face each other across thermoplastic resin layers. In the laminated circuit substrate, the first conductor pattern includes a first principal surface, the second conductor pattern includes a second principal surface, the first principal surface faces the second conductor pattern, the second principal surface faces the first conductor pattern, and the first principal surface and the second principal surface are subject to a roughening process.


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