The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 22, 2018

Filed:

Jun. 08, 2015
Applicant:

International Business Machines Corporation, Armonk, NY (US);

Inventors:

Mahesh Bohra, Austin, TX (US);

Sungjun Chun, Austin, TX (US);

Jesus Montanez, Austin, TX (US);

Daniel I. Rodriguez, Austin, TX (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 3/20 (2006.01); H05K 1/14 (2006.01); H05K 1/11 (2006.01); H05K 1/02 (2006.01); H05K 3/00 (2006.01); H05K 3/22 (2006.01); H05K 3/32 (2006.01); H05K 1/18 (2006.01);
U.S. Cl.
CPC ...
H05K 1/144 (2013.01); H05K 1/0251 (2013.01); H05K 1/0298 (2013.01); H05K 1/115 (2013.01); H05K 3/0047 (2013.01); H05K 3/22 (2013.01); H05K 3/325 (2013.01); H05K 1/183 (2013.01); H05K 2201/09845 (2013.01); H05K 2203/0207 (2013.01); Y10T 29/49126 (2015.01); Y10T 156/1056 (2015.01);
Abstract

A device has a base with a mounting surface with a length and a stack, the stack having a diameter smaller than the length and fastened to the mounting surface. The stack may have a plurality of stack conductive layers in addition to a plurality of insulating layers that separate each of the plurality of stack conductive layers. The stack conductive layers may be separated in a manner that aligns them with corresponding printed circuit board conductive layers when the stack portion of the device is inserted into an aperture in a printed circuit board.


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