The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 22, 2018

Filed:

Jun. 03, 2016
Applicant:

Mstar Semiconductor, Inc., Hsinchu Hsien, TW;

Inventors:

Chia-Wei Chen, Hsinchu Hsien, TW;

Kai-Wen Cheng, Hsinchu Hsien, TW;

Ko-Yin Lai, Hsinchu Hsien, TW;

Assignee:

MStar Semiconductor, Inc., Hsinchu Hsien, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H03H 7/30 (2006.01); H03H 7/40 (2006.01); H03K 5/159 (2006.01); H04L 25/03 (2006.01);
U.S. Cl.
CPC ...
H04L 25/03019 (2013.01); H04L 2025/03636 (2013.01);
Abstract

An equalization enhancing module includes: a multiplication unit, multiplying a plurality of equalized signals by a scaling coefficient to obtain a plurality of scaled signals; a determination unit, coupled to the multiplication unit, determining whether the plurality of scaled signals are located in a predetermined region to generate a plurality of determination results; a ratio calculating unit, coupled to the determination unit, calculating an inner ratio associated with a ratio of the plurality of scaled signals located in the predetermined region; and a coefficient calculating unit, coupled to the ratio calculating unit, calculating the scaling coefficient according to the inner ratio.


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