The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 22, 2018
Filed:
Feb. 02, 2017
Jtekt Corporation, Osaki-shi, Osaka, JP;
Yuichi Toyama, Owariasahi, JP;
JTEKT CORPORATION, Osaka, JP;
Abstract
A circuit board assembly and a method of manufacturing the same is provided, by which, when external pressure is applied to a cover, deformation of the cover caused by the external pressure is suppressed and no adverse effect is produced to electronic components on a circuit board. A cover of a circuit board assembly includes a first cover to cover a first surface of a circuit board and a second cover to cover a second surface of the circuit board. A projection portion projects from an inner surface of the first cover. When a complete circuit board assembly is formed by insert-molding using the circuit board assembly as an insert part, the projection portion suppresses deformation of the first cover and the second cover.