The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 22, 2018

Filed:

Mar. 24, 2014
Applicant:

Pioneer Corporation, Tokyo, JP;

Inventors:

Takeru Okada, Kawasaki, JP;

Ayako Yoshida, Kawasaki, JP;

Assignee:

PIONEER CORPORATION, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 51/52 (2006.01); H01L 51/00 (2006.01); B32B 27/08 (2006.01);
U.S. Cl.
CPC ...
H01L 51/5253 (2013.01); B32B 27/08 (2013.01); H01L 51/003 (2013.01); H01L 51/004 (2013.01); H01L 51/0097 (2013.01); H01L 51/5268 (2013.01); B32B 2307/422 (2013.01); B32B 2457/00 (2013.01); B32B 2457/206 (2013.01); Y02E 10/549 (2013.01); Y02P 70/521 (2015.11);
Abstract

A light emitting portion () is formed on a first surface of a substrate () (upper surface of the substrate () in an example illustrated in FIG.). A sealing member () seals the light emitting portion (). In addition, the substrate () includes a first resin layer (), a first inorganic layer (), and a second resin layer (). The first resin layer () is formed of a first resin material. The second resin layer () is formed of the first resin material, and is positioned closer to the first surface side of the substrate () than the first resin layer (). The first inorganic layer () is positioned between the first resin layer () and the second resin layer ().


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