The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 22, 2018

Filed:

Mar. 20, 2015
Applicant:

Sony Corporation, Tokyo, JP;

Inventors:

Silvia Rosselli, Mannheim, DE;

Tzenka Miteva, Stuttgart, DE;

Gabriele Nelles, Stuttgart, DE;

Ameneh Bamedi Zilai, Stuttgart, DE;

Vitor Deichmann, Stuttgart, DE;

Assignee:

SONY CORPORATION, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 51/00 (2006.01); C07D 405/04 (2006.01); C07D 401/12 (2006.01); C07D 401/10 (2006.01); C07F 5/02 (2006.01); C07D 471/06 (2006.01); C07D 401/04 (2006.01); C09K 11/06 (2006.01); C09B 3/14 (2006.01); C07D 209/86 (2006.01); H01L 27/30 (2006.01); C07D 421/14 (2006.01); C07D 401/06 (2006.01); C07D 421/04 (2006.01); C07D 409/14 (2006.01); C09B 5/62 (2006.01); C07D 409/04 (2006.01); C07D 221/18 (2006.01);
U.S. Cl.
CPC ...
H01L 51/0062 (2013.01); C07D 209/86 (2013.01); C07D 221/18 (2013.01); C07D 401/04 (2013.01); C07D 401/06 (2013.01); C07D 401/10 (2013.01); C07D 401/12 (2013.01); C07D 405/04 (2013.01); C07D 409/04 (2013.01); C07D 409/14 (2013.01); C07D 421/04 (2013.01); C07D 421/14 (2013.01); C07D 471/06 (2013.01); C07F 5/025 (2013.01); C09B 3/14 (2013.01); C09B 5/62 (2013.01); C09K 11/06 (2013.01); H01L 51/0055 (2013.01); H01L 51/0061 (2013.01); H01L 51/0065 (2013.01); H01L 51/0067 (2013.01); H01L 51/0068 (2013.01); H01L 51/0072 (2013.01); C09K 2211/1007 (2013.01); C09K 2211/1011 (2013.01); C09K 2211/1014 (2013.01); C09K 2211/1029 (2013.01); C09K 2211/1088 (2013.01); C09K 2211/1092 (2013.01); C09K 2211/1096 (2013.01); H01L 27/307 (2013.01);
Abstract

The present disclosure relates to perylene-based molecules and their use in photoelectric conversion layer(s) and/or an organic or hybrid image sensor. The present disclosure also relates to absorption layer(s) and photoelectric conversion layer(s) comprising a molecule according to the present disclosure. The present disclosure also relates to a device, comprising a photoelectric conversion layer comprising at least one perylene-based molecule. Moreover, the present disclosure relates to an organic image sensor or a hybrid Silicon-organic image sensor comprising photoelectric conversion layer(s) according to the present disclosure.


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