The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 22, 2018

Filed:

Jul. 03, 2014
Applicant:

Osram Opto Semiconductors Gmbh, Regensburg, DE;

Inventors:

Michael Zitzlsperger, Regensburg, DE;

Tobias Gebuhr, Regensburg, DE;

Thomas Schwarz, Regensburg, DE;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 33/62 (2010.01); H01L 33/50 (2010.01); H01L 33/54 (2010.01); H01L 23/00 (2006.01); H01L 25/075 (2006.01); H01L 33/48 (2010.01);
U.S. Cl.
CPC ...
H01L 33/62 (2013.01); H01L 24/73 (2013.01); H01L 33/505 (2013.01); H01L 33/507 (2013.01); H01L 33/54 (2013.01); H01L 25/0753 (2013.01); H01L 33/486 (2013.01); H01L 2224/16245 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48471 (2013.01); H01L 2224/48479 (2013.01); H01L 2924/12041 (2013.01); H01L 2924/1815 (2013.01); H01L 2933/005 (2013.01); H01L 2933/0033 (2013.01); H01L 2933/0041 (2013.01); H01L 2933/0066 (2013.01);
Abstract

A method can be used for producing an optoelectronic device. A first leadframe section with a component is provided. The component is designed to emit electromagnetic radiation on an emission side. The emission side faces away from the carrier. A second leadframe section is provided. In a first method step the component and the two leadframe sections are encapsulated with a first potting material in such a way that the component and the leadframe sections are embedded into a potting body, but wherein at least part of the emission area of the component remains free of the first potting material and a cutout is formed in the potting body at least above the emission area of the component. In a second method step a second potting material is molded into the cutout of the potting body, such that the emission side of the component is covered with the second potting material.


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