The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 22, 2018
Filed:
May. 10, 2017
Applicant:
Harvatek Corporation, Hsinchu, TW;
Inventors:
Zhi-Ting Ye, Hsinchu, TW;
Shyi-Ming Pan, Hsinchu, TW;
Assignee:
Harvatek Corporation, Hsinchu, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 33/00 (2010.01); F21K 99/00 (2016.01); F21V 3/04 (2018.01); H01L 33/60 (2010.01); H01L 33/58 (2010.01);
U.S. Cl.
CPC ...
H01L 33/60 (2013.01); H01L 33/58 (2013.01); H01L 2933/0016 (2013.01); H01L 2933/0058 (2013.01);
Abstract
The present invention provides a light-emitting diode (LED) package structure and the method for manufacturing the same. First, a ceramic substrate is provided. Then, an ultraviolet (UV) LED chip, a light-guiding layer, and a metal reflective layer are disposed on the substrate sequentially. By means of the metal reflective layer, the emission light of the UV LED from the light-emitting side is reflected laterally and thus making the UV LED package structure output a plane light source.