The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 22, 2018

Filed:

Jan. 23, 2017
Applicant:

Samsung Electronics Co., Ltd., Suwon-si, Gyeonggi-do, KR;

Inventors:

Hyuk Kim, Seongnam-si, KR;

Seung-pil Chung, Seongnam-si, KR;

Jae-ho Min, Suwon-si, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/52 (2006.01); H01L 27/112 (2006.01); H01L 23/528 (2006.01);
U.S. Cl.
CPC ...
H01L 27/11286 (2013.01); H01L 23/528 (2013.01);
Abstract

Semiconductor chips are provided. A semiconductor chip includes a peripheral circuit region on a substrate. The semiconductor chip includes a semiconductor layer on the peripheral circuit region. The semiconductor chip includes a cell region on the semiconductor layer. Moreover, the semiconductor chip includes a layer/connector that is adjacent the semiconductor layer. Methods of manufacturing semiconductor chips are also provided.


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