The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 22, 2018

Filed:

May. 24, 2017
Applicants:

Innolux Corporation, Miao-Li County, TW;

Advanced Optoelectronic Technology Inc., Hsinchu county, TW;

Inventors:

Chun-Hsien Lin, Miao-Li County, TW;

Tsau-Hua Hsieh, Miao-Li County, TW;

Po-Min Tu, Miao-Li County, TW;

Tzu-Chien Hung, Miao-Li County, TW;

Chien-Chung Peng, Miao-Li County, TW;

Shih-Cheng Huang, Miao-Li County, TW;

Assignees:

Innolux Corporation, Miao-Li County, TW;

Advanced Optoelectronics Technology Inc., Hsinchu county, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 33/00 (2010.01); H01L 25/075 (2006.01); H01L 25/16 (2006.01); H01L 27/12 (2006.01); H01L 27/15 (2006.01); H01L 33/48 (2010.01); H01L 33/54 (2010.01); H01L 33/62 (2010.01);
U.S. Cl.
CPC ...
H01L 25/0753 (2013.01); H01L 25/075 (2013.01); H01L 25/0756 (2013.01); H01L 25/167 (2013.01); H01L 27/1214 (2013.01); H01L 27/15 (2013.01); H01L 33/0079 (2013.01); H01L 33/486 (2013.01); H01L 33/54 (2013.01); H01L 33/62 (2013.01); H01L 2933/005 (2013.01); H01L 2933/0033 (2013.01); H01L 2933/0066 (2013.01);
Abstract

A display apparatus and a fabricating method thereof are provided. The display apparatus includes a substrate, a light emitting diode, a first bump, a first insulating layer and a second insulating layer. The light emitting diode has a first surface and a second surface opposite each other, wherein the first surface faces the substrate. The light emitting diode is bonded to the substrate through the first bump. The first insulating layer is disposed on a periphery of the first bump and the light emitting diode, and contacts the first bump and the first surface. The second insulating layer is disposed on the substrate and surrounds at least a portion of the first insulating layer.


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