The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 22, 2018
Filed:
May. 25, 2016
Texas Instruments Incorporated, Dallas, TX (US);
Danyang Zhu, Beijing, CN;
Zhuang Ma, Beijing, CN;
Xinyu Yin, Beijing, CN;
Michael Dean Shilhanek, Garland, TX (US);
Steven Bolen, Plano, TX (US);
Albert Eardley, Carrizo Springs, TX (US);
Abha Singh Kasper, Dallas, TX (US);
Texas Instruments Incorporated, Dallas, TX (US);
Abstract
A multichip module (MCM) device include a first die including functional circuitry bonded by a plurality of inter-die bond wires (bond wires) to a second die having functional circuitry. A first channel (Channel A) and second channel (Channel B) each have separate top and bottom signal paths (signal paths) including one of the bond wires. A failure of any of the signal paths does not affect functionality of the device. The first die includes input pins including a first input pin (P), a second input pin (P), and coupling circuitry including cross-channel test circuitry positioned between the input pins and the functional circuitry. The coupling circuitry provides for Channel A and Channel B a first configuration for normal mode operation and a second configuration for test mode operation for single bond wire testing for checking continuity of any of the bond wires.