The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 22, 2018
Filed:
Mar. 23, 2017
Delphi Technologies, Inc., Troy, MI (US);
David W. Zimmerman, Noblesville, IN (US);
Michael J. Pepples, Noblesville, IN (US);
David W. Ihms, Russiaville, IN (US);
DELPHI TECHNOLOGIES, INC., Troy, MI (US);
Abstract
A circuit-board-assembly includes a printed-circuit-board, an integrated-circuit-die, a ball-grid-array, a barrier-material, and an adhesive-material. The printed-circuit-board includes a mounting-surface that defines a plurality of contact-pads and a continuous-trace that interconnects a selected-group of the contact-pads. The integrated-circuit-die includes an electrical-circuit having a plurality of solder-pads. The ball-grid-array includes a plurality of solder-balls interposed between the contact-pads and the solder-pads. The plurality of solder-balls establish electrical communication between the electrical-circuit and the contact-pads. The barrier-material is located between a string of solder-balls that are attached to the selected-group of the contact-pads to create a barrier. The barrier segregates an underfill-region from a non-underfill-region between the printed-circuit-board and the integrated-circuit-die. The barrier is in direct-contact with the string of the solder-balls, the integrated-circuit-die, and the continuous-trace. The adhesive-material is in direct contact with a portion of the underfill-region and the barrier prevents the adhesive-material from encroaching upon the non-underfill-region.