The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 22, 2018

Filed:

Sep. 04, 2013
Applicant:

Toshiba Memory Corporation, Minato-ku, JP;

Inventors:

Satoru Takaku, Yokohama, JP;

Chizuto Takatsuka, Yokohama, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/552 (2006.01); H01L 23/16 (2006.01); H01L 23/31 (2006.01);
U.S. Cl.
CPC ...
H01L 23/552 (2013.01); H01L 23/16 (2013.01); H01L 23/3135 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/49175 (2013.01); H01L 2224/73265 (2013.01); H01L 2924/181 (2013.01);
Abstract

A semiconductor device includes: a substrate on which a first contact portion is formed; a lower shield plate provided above the substrate to avoid the first contact portion and including a magnetic substance; a semiconductor chip provided above the lower shield plate and including a second contact portion electrically connected to the first contact portion, and a connection member that electrically connects the first contact portion and the second contact portion; and an upper shield plate provided above the semiconductor chip to avoid the second contact portion and the connection member and including a magnetic substance. An end of at least one of the lower shield plate and the upper shield plate is bent toward the other one of the lower shield plate and the upper shield plate so have a side wall portion whose tip is connected to the other one of the lower shield plate and the upper shield plate.


Find Patent Forward Citations

Takaku, Satoru. (2018). Semiconductor apparatus and manufacturing method for same (U.S. Patent No. 9978690). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9978690

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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