The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 22, 2018

Filed:

May. 27, 2016
Applicant:

The Regents of the University of California, Oakland, CA (US);

Inventors:

Qun Gu, Davis, CA (US);

Xiaoguang Liu, Davis, CA (US);

Neville C. Luhmann, Jr., Walnut Creek, CA (US);

Bo Yu, Davis, CA (US);

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01P 1/02 (2006.01); H01L 23/50 (2006.01); H01P 5/08 (2006.01); H01L 23/52 (2006.01); H01L 23/66 (2006.01); H01P 5/107 (2006.01);
U.S. Cl.
CPC ...
H01L 23/50 (2013.01); H01L 23/52 (2013.01); H01L 23/66 (2013.01); H01P 5/08 (2013.01);
Abstract

An interconnect is described that comprises an interconnect channel, and two channel couplers coupled to the two ends of the interconnect channel through respective stoppers that provide a gap between the channel couplers and the interconnect channel. Each channel coupler can comprise a coplanar waveguide, a microstrip line, and a patch-antenna based coupler. The interconnect can enable communication between integrated circuits using signal waves having a frequency between 100 GHz and 3 THz.


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