The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 22, 2018

Filed:

Sep. 30, 2016
Applicant:

Beijing Naura Microelectronics Equipment Co., Ltd., Beijing, CN;

Inventor:

Dong Xu, Beijing, CN;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/687 (2006.01); H01L 21/67 (2006.01);
U.S. Cl.
CPC ...
H01L 21/68707 (2013.01); H01L 21/67265 (2013.01);
Abstract

A wafer pick-and-place method and system is provided. During the wafer pick-and-place operation, the distance between the fork of the robot and the target wafer is detected to determine whether the robot will collide with the target wafer. Furthermore, the tilted angle of the target wafer relative to the fork is calculated to determine whether the wafer will slip off. If collision or wafer slippery may occur, the pick-and-place operation is stopped. Therefore, wafer damages due to unexpected contact between the fork and the wafer can be avoided, and wafer handling safety can be improved.


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