The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 22, 2018

Filed:

Nov. 27, 2014
Applicant:

Beijing Nmc Co., Ltd., Beijing, CN;

Inventors:

Yanzhao Zhang, Beijing, CN;

Qing She, Beijing, CN;

Peng Chen, Beijing, CN;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C23C 14/35 (2006.01); H01J 37/34 (2006.01); C23C 14/14 (2006.01); H01J 37/32 (2006.01); H01L 21/285 (2006.01);
U.S. Cl.
CPC ...
H01J 37/3441 (2013.01); C23C 14/14 (2013.01); C23C 14/35 (2013.01); H01J 37/32651 (2013.01); H01J 37/3405 (2013.01); H01L 21/2855 (2013.01);
Abstract

A reaction chamber and a semiconductor processing device, comprise a Faraday shielding ring () made of a magnetic insulation material and an insulating ring () made of an insulating material; the Faraday shielding ring () is provided with a slot thereon passing through a ring surface thereof in an axial direction; both the Faraday shielding ring () and the insulating ring () are disposed in the reaction chamber surrounding an inner peripheral wall of the reaction chamber, and the Faraday shielding ring () is stacked on the insulating ring () in a vertical direction. A shielding ring () is disposed surrounding an inner peripheral wall of the insulating ring (), the shielding ring () is connected to an area of a lower surface of the Faraday shielding ring () adjacent to a center of the reaction chamber, and the shielding ring () is made of a magnetic insulation material and provided with a slot thereon passing through a ring surface thereof in an axis direction. The reaction chamber and the semiconductor processing device can not only avoid or reduce the risk of sparking, but also reduce the pollution of the reaction chamber caused by the flaking off of metal particles; and in addition, it is possible to increase an inner diameter and an available space of the reaction chamber.


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