The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 22, 2018

Filed:

Dec. 12, 2014
Applicant:

Murata Manufacturing Co., Ltd., Nagaokakyo-shi, Kyoto-fu, JP;

Inventors:

Kazuto Ogawa, Nagaokakyo, JP;

Isao Kato, Nagaokakyo, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 7/00 (2006.01); H05K 1/16 (2006.01); H01G 2/06 (2006.01); H05K 1/11 (2006.01); H01G 4/12 (2006.01); H01G 4/30 (2006.01); H05K 1/18 (2006.01); H05K 3/30 (2006.01); H05K 3/00 (2006.01);
U.S. Cl.
CPC ...
H01G 2/065 (2013.01); H01G 2/06 (2013.01); H01G 4/12 (2013.01); H01G 4/30 (2013.01); H05K 1/111 (2013.01); H05K 1/181 (2013.01); H05K 3/303 (2013.01); H05K 3/0052 (2013.01); H05K 3/0097 (2013.01); H05K 2201/09063 (2013.01); H05K 2201/09227 (2013.01); H05K 2201/10015 (2013.01); H05K 2201/2045 (2013.01); Y02P 70/611 (2015.11); Y10T 29/4913 (2015.01);
Abstract

An electronic component unit includes a substrate including principal surfaces opposing each other and side surfaces between the principal surfaces, and components mounted on the principal surface of the substrate. The side surfaces include first side surfaces formed before the components are mounted and second side surfaces formed after the components are mounted. As viewed from a line normal to the principal surface of the substrate, distances between the first side surfaces and the components are different from distances between the second side surfaces and the components.


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