The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 22, 2018

Filed:

Mar. 10, 2014
Applicant:

Omron Automotive Electronics Co., Ltd., Aichi, JP;

Inventors:

Koji Hachiya, Hyoto, JP;

Tomoyoshi Kobayashi, Aichi, JP;

Koichi Nakabayashi, Kyoto, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01F 27/08 (2006.01); H01F 27/02 (2006.01); H01F 27/28 (2006.01); H01F 27/22 (2006.01); H01F 37/00 (2006.01); H05K 1/16 (2006.01); H05K 1/02 (2006.01); H05K 3/00 (2006.01);
U.S. Cl.
CPC ...
H01F 27/2876 (2013.01); H01F 27/22 (2013.01); H01F 27/2804 (2013.01); H01F 37/00 (2013.01); H05K 1/165 (2013.01); H01F 2027/2819 (2013.01); H05K 1/0204 (2013.01); H05K 1/0263 (2013.01); H05K 3/0061 (2013.01); H05K 2201/086 (2013.01); H05K 2201/10409 (2013.01); H05K 2201/10416 (2013.01);
Abstract

A printed circuit board with integrated coil includes: a plurality of layers; and coil patterns which are formed of a conductor and which are provided in at least one outer surface layer and another layer of the plurality of layers. A heat-dissipation pattern formed of a conductor is provided on at least the one outer surface layer so as to correspond to the coil pattern provided in the another layer. The coil pattern provided in the one outer surface layer and the heat-dissipation pattern provided in the one outer surface layer are separated from each other. A thermal inter-layer connector formed of a conductor is provided to connect the coil pattern provided in the another layer and the heat-dissipation pattern provided in the one outer surface layer which correspond to each other.


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