The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 22, 2018

Filed:

Mar. 21, 2017
Applicant:

Fingerprint Cards Ab, Göteborg, SE;

Inventors:

Karl Lundahl, Göteborg, SE;

Robert Hägglund, Linköping, SE;

Emil Hjalmarson, Linköping, SE;

Rolf Sundblad, Ljungsbro, SE;

Christer Jansson, Linköping, SE;

Assignee:

Fingerprint Cards AB, Göteborg, SE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06K 9/00 (2006.01); G06F 3/041 (2006.01);
U.S. Cl.
CPC ...
G06K 9/0002 (2013.01); G06K 9/00087 (2013.01); G06F 3/0412 (2013.01); G06F 2203/0338 (2013.01); G06F 2203/04103 (2013.01);
Abstract

There is provided a capacitive fingerprint sensing device for sensing a fingerprint pattern of a finger, said capacitive fingerprint sensing device comprising: a protective top layer to be touched by said finger; a first metal layer comprising a two-dimensional array of sensing structures arranged underneath said top layer; a second metal layer, arranged underneath said first metal layer, comprising a plurality of conductive structures a dielectric layer arranged between the first and second metal layers to electrically insulate the first metal layer from the second metal layer, the dielectric layer comprising a low-k material; and readout circuitry arranged underneath said second metal layer and coupled to each of the electrically conductive sensing structures by means of via connections to receive a sensing signal indicative of a distance between said finger and said sensing structure. There is also provided a method for manufacturing such a device.


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