The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 22, 2018

Filed:

Oct. 28, 2014
Applicant:

Kaneka Corporation, Osaka-shi, JP;

Inventor:

Toshihiko Okamoto, Takasago, JP;

Assignee:

KANEKA CORPORATION, Osaka-shi, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08L 83/00 (2006.01); C08L 63/00 (2006.01); C08G 59/06 (2006.01); C08G 59/14 (2006.01); C09J 11/04 (2006.01); C09J 11/08 (2006.01); C09J 163/00 (2006.01); C08L 51/04 (2006.01);
U.S. Cl.
CPC ...
C08L 63/00 (2013.01); C08G 59/063 (2013.01); C08G 59/14 (2013.01); C08G 59/1477 (2013.01); C09J 11/04 (2013.01); C09J 11/08 (2013.01); C09J 163/00 (2013.01); C08L 51/04 (2013.01);
Abstract

A curable resin composition of the present invention contains 1 to 100 parts by mass of a polymer fine particle (B) relative to 100 parts by mass of an epoxy resin (A), wherein the polymer fine particle has a core-shell structure, the core layer of the polymer fine particle is diene rubber, the content of the epoxy group of the polymer fine particle (B) is 0.01 to 0.2 mmol/g. A curable resin composition (I) of the first embodiment contains 0.5 to 30 parts by mass of fumed silica as an inorganic filler (C). In addition, a curable resin composition (II) of the second embodiment contains bisphenol A epoxy resin and rubber-modified epoxy resin and/or urethane-modified epoxy resin as the epoxy resin (A).


Find Patent Forward Citations

Loading…