The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 22, 2018
Filed:
Mar. 03, 2015
Dic Corporation, Tokyo, JP;
Koji Hayashi, Ichihara, JP;
Makoto Kimura, Ichihara, JP;
Kunihiro Morinaga, Ichihara, JP;
Shigeki Matsui, Ichihara, JP;
DIC Corporation, Tokyo, JP;
Abstract
Provided is an epoxy resin which has a low viscosity and excellent impregnation capability into reinforcing fibers and provides a cured product having a high elastic modulus and excellent heat resistance when the epoxy resin is used for a fiber-reinforced resin material, and a method for producing the epoxy resin, a curable resin composition, and a cured product thereof, a fiber-reinforced composite material, and a molded article. An epoxy resin which is polyglycidyl ether that is a polycondensation product of phenol and hydroxybenzaldehyde, the resin includes the trinuclear body (X) represented by the following Structural Formula (1), in which the content of a [o,p,p] bonding body (x) represented by the following Structural Formula (1-1) among the trinuclear body (X) is in the range of 5% to 18% in terms of an area ratio as measured by liquid chromatography.