The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 22, 2018

Filed:

Aug. 12, 2014
Applicant:

Ube Industries, Ltd., Yamaguchi, JP;

Inventors:

Hiroki Akatsu, Yamaguchi, JP;

Hideki Fujimura, Yamaguchi, JP;

Riyousuke Sasaki, Yamaguchi, JP;

Shinichi Hirayama, Yamaguchi, JP;

Tetsurou Hiroki, Yamaguchi, JP;

Hideki Harada, Yamaguchi, JP;

Assignee:

Ube Industries, Ltd., Ube-shi, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 27/20 (2006.01); B32B 15/088 (2006.01); B29C 45/14 (2006.01); B29C 45/00 (2006.01); B32B 15/06 (2006.01); B32B 15/08 (2006.01); B32B 27/18 (2006.01); B32B 27/34 (2006.01); B32B 27/36 (2006.01); B32B 27/28 (2006.01); C08G 73/02 (2006.01); B29K 77/00 (2006.01); B29K 105/00 (2006.01); B29K 105/16 (2006.01); B29K 509/08 (2006.01); B29K 705/02 (2006.01);
U.S. Cl.
CPC ...
B32B 27/20 (2013.01); B29C 45/0001 (2013.01); B29C 45/14311 (2013.01); B32B 15/06 (2013.01); B32B 15/08 (2013.01); B32B 15/088 (2013.01); B32B 27/18 (2013.01); B32B 27/285 (2013.01); B32B 27/34 (2013.01); B32B 27/36 (2013.01); B29K 2077/00 (2013.01); B29K 2105/0005 (2013.01); B29K 2105/16 (2013.01); B29K 2509/08 (2013.01); B29K 2705/02 (2013.01); B32B 2262/101 (2013.01); B32B 2264/102 (2013.01); B32B 2264/104 (2013.01); B32B 2264/108 (2013.01); B32B 2274/00 (2013.01); B32B 2307/202 (2013.01); B32B 2307/302 (2013.01); B32B 2307/306 (2013.01); B32B 2307/54 (2013.01); B32B 2307/558 (2013.01); B32B 2307/728 (2013.01); B32B 2307/7242 (2013.01); B32B 2307/7265 (2013.01); B32B 2307/734 (2013.01); B32B 2605/08 (2013.01);
Abstract

Provided is a composite body in which a resin and a metal are contact-bonded with excellent adhesive force. Also provided is a composite body which is suppressed in decrease of bonding strength between a resin and a metal due to water absorption of the resin even if the composite body is left in rain or water, or is left in a high humidity environment or the like for a long period of time. The present invention relates to a composite body which is obtained by contact-bonding a thermoplastic resin (A) and a metal (B), and which is characterized in that the thermoplastic resin (A) is a polyamide elastomer (1A) or a thermoplastic resin composition (2A) that contains a water absorbent thermoplastic resin (2a) and a metal hydroxide (2b).


Find Patent Forward Citations

Loading…