The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 22, 2018

Filed:

Jul. 25, 2016
Applicant:

Sophion Bioscience A/s, Ballerup, DK;

Inventors:

Anders Brask, Kgs. Lyngby, DK;

Jonatan Kutchinsky, Ballerup, DK;

Assignee:

SOPHION BIOSCIENCE A/S, Ballerup, DK;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B01L 3/00 (2006.01); B32B 37/12 (2006.01); C09J 5/00 (2006.01);
U.S. Cl.
CPC ...
B01L 3/502707 (2013.01); B01L 3/50 (2013.01); B01L 3/5085 (2013.01); B32B 37/1284 (2013.01); C09J 5/00 (2013.01); B01L 2200/0689 (2013.01); B01L 2200/10 (2013.01); B01L 2200/12 (2013.01); B01L 2300/0645 (2013.01); B01L 2300/0819 (2013.01); Y10T 156/10 (2015.01);
Abstract

A chip assembly for use in a microfluidic analysis system, such as a patch clamp apparatus, comprises a chip having an outer wall, a carrier structure comprising an aperture for receiving the chip, the aperture defining an inner wall, wherein the chip is arranged in the aperture with a liquid tight seal between the outer wall of the chip and the inner wall of the aperture. The chip may be sealed and bonded to the carrier structure by means of a bonding material, such as an UV curing adhesive. A through hole in the chip is aligned with the aperture in the carrier structure. A method for manufacturing the chip assembly is further disclosed.


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