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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9974966 B1

PDFFull Text
Date of Patent:
May. 22, 2018

Filed:

Dec. 15, 2015

Systems and methods for manufacturing header subassembly

Applicant:

Pacesetter, Inc., Sylmar, CA (US);

Inventors:

Dino Bortolin, Camarillo, CA (US);

Ofer Rosenzweig, Chatsworth, CA (US);

Assignee:

PACESETTER, INC., Sylmar, CA (US);

Attorney:
Primary Examiner:

Michael Kahelin

Int. Cl.
CPC ...
A61N 1/375 (2006.01); A61N 1/05 (2006.01); A61N 1/36 (2006.01); A61N 1/362 (2006.01); A61N 1/372 (2006.01); B29C 65/20 (2006.01); B29C 43/18 (2006.01); B29C 45/14 (2006.01); B29K 701/12 (2006.01); B29K 701/10 (2006.01); B29K 663/00 (2006.01); B29L 31/00 (2006.01);
U.S. Cl.
CPC ...
A61N 1/3752 (2013.01); A61N 1/0534 (2013.01); A61N 1/362 (2013.01); A61N 1/36067 (2013.01); A61N 1/37229 (2013.01); B29C 43/18 (2013.01); B29C 45/14819 (2013.01); B29C 65/20 (2013.01); B29C 2043/189 (2013.01); B29K 2663/00 (2013.01); B29K 2701/10 (2013.01); B29K 2701/12 (2013.01); B29L 2031/753 (2013.01);
Abstract

The present disclosure provides systems and methods for assembling a subassembly for use in manufacturing an implantable device header. A method includes placing a first split web into a top platen, placing a second split web into a bottom platen, placing a conductor assembly and an antenna assembly in the bottom platen on top of the second split web, compressing the top and bottom platens together, heating the top and bottom platens until a predetermined temperature and a predetermined pressure are reached, such that first split web is fused to the second split web to form the subassembly, separating the top and bottom platens, and removing the formed subassembly.

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