The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 15, 2018
Filed:
Jan. 31, 2013
Applicant:
Fuji Machine Mfg. Co., Ltd., Chiryu, JP;
Inventors:
Hideyasu Takamiya, Chiryu, JP;
Yukinori Nakayama, Hekinan, JP;
Assignee:
FUJI MACHINE MFG. CO., LTD., Chiryu, JP;
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/67 (2006.01); H05K 13/00 (2006.01); H05K 13/04 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H05K 13/0061 (2013.01); H01L 21/67144 (2013.01); H01L 24/75 (2013.01); H05K 13/043 (2013.01); H01L 2224/7565 (2013.01);
Abstract
A supply head of a die supply apparatus is detachably held by a head holding unit of a head moving mechanism. The supply head held by the head holding unit is replaceable with a supply head having the same number of nozzles as the number of nozzles of a mounting head of a component mounting machine. A nozzle arrangement of the supply head of the die supply apparatus has the same arrangement as a nozzle arrangement of the mounting head of the component mounting machine.