The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 15, 2018
Filed:
May. 01, 2017
Applicant:
Asahi Glass Company, Limited, Tokyo, JP;
Inventor:
Shintaro Takahashi, Tokyo, JP;
Assignee:
Ashai Glass Company, Limited, Tokyo, JP;
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/03 (2006.01); H05K 1/00 (2006.01); H05K 3/40 (2006.01); H01L 23/15 (2006.01); H01L 23/498 (2006.01); H01L 21/48 (2006.01); H05K 1/11 (2006.01); H05K 3/00 (2006.01); H05K 3/10 (2006.01); H05K 1/09 (2006.01); H05K 3/06 (2006.01); H05K 3/46 (2006.01); H05K 3/42 (2006.01);
U.S. Cl.
CPC ...
H05K 3/4038 (2013.01); H01L 21/486 (2013.01); H01L 23/15 (2013.01); H01L 23/49827 (2013.01); H05K 1/032 (2013.01); H05K 1/0306 (2013.01); H05K 1/09 (2013.01); H05K 1/11 (2013.01); H05K 1/115 (2013.01); H05K 3/0029 (2013.01); H05K 3/0094 (2013.01); H05K 3/06 (2013.01); H05K 3/10 (2013.01); H05K 3/4644 (2013.01); H01L 2924/0002 (2013.01); H05K 3/42 (2013.01); H05K 2201/068 (2013.01); H05K 2201/09563 (2013.01); H05K 2201/10378 (2013.01); H05K 2203/0221 (2013.01); H05K 2203/0264 (2013.01); H05K 2203/06 (2013.01); H05K 2203/07 (2013.01); H05K 2203/107 (2013.01); H05K 2203/1461 (2013.01); Y10T 156/10 (2015.01); Y10T 156/1056 (2015.01); Y10T 428/24331 (2015.01);
Abstract
A method of manufacturing an intermediate product for an interposer including a glass substrate having a plurality of through holes is provided. The method includes a step of forming a resin layer on a support substrate, and a step of forming a laminated body by adhering the glass substrate having the plurality of through holes on the resin layer. The glass substrate having the plurality of through holes has a thickness within a range of 0.05 mm to 0.3 mm.