The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 15, 2018

Filed:

Jan. 30, 2014
Applicant:

Osram Gmbh, Munich, DE;

Inventors:

Thomas Preuschl, Sinzing, DE;

Peter Sachsenweger, Zeitlarn, DE;

Assignee:

OSRAM GmbH, Munich, DE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/00 (2006.01); H05K 1/18 (2006.01); F21V 15/01 (2006.01); F21V 17/10 (2006.01); F21V 19/00 (2006.01); F21V 23/06 (2006.01); H05K 3/32 (2006.01); F21K 9/90 (2016.01); F21K 9/20 (2016.01); F21V 23/00 (2015.01); F21V 29/00 (2015.01); F21V 29/507 (2015.01); F21Y 105/00 (2016.01); F21Y 105/10 (2016.01); F21Y 115/10 (2016.01); F21Y 115/15 (2016.01);
U.S. Cl.
CPC ...
H05K 1/18 (2013.01); F21K 9/20 (2016.08); F21K 9/90 (2013.01); F21V 15/01 (2013.01); F21V 17/10 (2013.01); F21V 17/101 (2013.01); F21V 19/0035 (2013.01); F21V 23/006 (2013.01); F21V 23/06 (2013.01); H05K 3/32 (2013.01); F21V 29/20 (2013.01); F21V 29/507 (2015.01); F21Y 2105/00 (2013.01); F21Y 2105/10 (2016.08); F21Y 2115/10 (2016.08); F21Y 2115/15 (2016.08); H05K 1/182 (2013.01); H05K 2201/0311 (2013.01); H05K 2201/049 (2013.01); H05K 2201/09072 (2013.01); H05K 2201/10106 (2013.01); H05K 2201/10189 (2013.01); H05K 2201/10962 (2013.01);
Abstract

Various embodiments may relate to an optoelectronic assembly, including a printed circuit board, which has a first and a second sides, a central cutout, at least one contact cutout and, at least one connection location, a carrier element coupled to the printed circuit board, has a first side and at least one contact location, at least one optoelectronic component arranged on the first side of the carrier element in such a way that it is exposed in the central cutout of the printed circuit board, a housing body, which has a central cutout and which is formed and physically coupled to the printed circuit board such that the optoelectronic component is exposed in the central cutout, and at least one contact element arranged on an inner side of the housing body is formed such that the contact element electrically couples the contact location of the carrier element to the connection location.


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