The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 15, 2018
Filed:
Oct. 19, 2015
Applicant:
Samsung Electro-mechanics Co., Ltd., Suwon-Si, Gyeonggi-Do, KR;
Inventors:
Taek Jung Lee, Suwon-Si, KR;
Yong Suk Kim, Suwon-Si, KR;
Assignee:
SEMCNS CO., LTD., Seongnam-si, Gyeonggi-do, KR;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 1/09 (2006.01); H05K 3/40 (2006.01); H05K 3/46 (2006.01); H01L 23/498 (2006.01); H01L 21/48 (2006.01);
U.S. Cl.
CPC ...
H05K 1/092 (2013.01); H05K 3/4007 (2013.01); H05K 3/4629 (2013.01); H01L 21/486 (2013.01); H01L 21/4857 (2013.01); H01L 23/49822 (2013.01); H01L 23/49827 (2013.01); H01L 2924/0002 (2013.01); H05K 2201/0338 (2013.01);
Abstract
A multilayer ceramic substrate includes stacked ceramic layers, and external electrodes including first conductive layers penetrating through one region of an outermost layer of the stacked ceramic layers to thereby be embedded therein, and second and third conductive layers sequentially stacked on the first conductive layers. Each of the first and second conductive layers is formed of a ceramic powder and a metal powder.