The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 15, 2018
Filed:
Aug. 30, 2012
Hae Yeon Kim, Seoul, KR;
Sung Bae Moon, Seoul, KR;
Jae Man Park, Seoul, KR;
Jeung Ook Park, Seoul, KR;
Jong Heum Yoon, Seoul, KR;
IN Hee Cho, Seoul, KR;
Hae Yeon Kim, Seoul, KR;
Sung Bae Moon, Seoul, KR;
Jae Man Park, Seoul, KR;
Jeung Ook Park, Seoul, KR;
Jong Heum Yoon, Seoul, KR;
In Hee Cho, Seoul, KR;
LG INNOTEK CO., LTD., Seoul, KR;
Abstract
An epoxy resin compound having an epoxy resin, a curing agent, and inorganic filler as main components is provided. The epoxy resin includes an epoxy resin of Chemical Formula. Accordingly, the thermal conductivity of the epoxy resin compound can be increased because the epoxy resin has a mesogen structure that facilitates crystallizability. In addition, a high radiant heat board can be provided by using the above-mentioned epoxy resin as an insulating material for a printed circuit board.