The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 15, 2018
Filed:
Nov. 17, 2015
Applicant:
Byd Company Limited, Shenzhen, Guangdong, CN;
Inventors:
Qiang Xu, Guangdong, CN;
Xinping Lin, Guangdong, CN;
Assignee:
BYD COMPANY LIMITED, Shenzhen, CN;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/05 (2006.01); H05K 3/18 (2006.01); C25D 11/24 (2006.01); H05K 3/44 (2006.01); C23C 18/18 (2006.01); C23C 18/16 (2006.01); C25D 11/08 (2006.01); C25D 11/16 (2006.01); C23C 18/40 (2006.01); C25D 11/10 (2006.01);
U.S. Cl.
CPC ...
H05K 1/053 (2013.01); C23C 18/1608 (2013.01); C23C 18/1612 (2013.01); C23C 18/1868 (2013.01); C23C 18/1879 (2013.01); C25D 11/246 (2013.01); H05K 3/185 (2013.01); H05K 3/44 (2013.01); C23C 18/40 (2013.01); C25D 11/08 (2013.01); C25D 11/10 (2013.01); C25D 11/16 (2013.01); H05K 2201/0116 (2013.01); H05K 2203/0315 (2013.01); H05K 2203/107 (2013.01); H05K 2203/1147 (2013.01);
Abstract
Embodiments of the present disclosure are directed to a circuit board. The circuit board comprises: an aluminum-based substrate; an alumina layer formed on at least one surface of the aluminum-based substrate; and a circuit layer formed on the alumina layer. The alumina layer comprises alumina and an element selected from a group consisting of chromium, nickel, a rare earth metal, and a combination thereof.