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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9974169 B1

PDFFull Text
Date of Patent:
May. 15, 2018

Filed:

Jan. 27, 2016

Resin composition, prepreg, metal-foil-clad laminate, resin composite sheet, and printed wiring board

Applicant:

Mitsubishi Gas Chemical Company, Inc., Tokyo, JP;

Inventors:

Takashi Kobayashi, Tokyo, JP;

Kentaro Takano, Tokyo, JP;

Sotaro Hiramatsu, Tokyo, JP;

Assignee:

MITSUBISHI GAS CHEMICAL COMPANY, INC., Tokyo, JP;

Attorney:

Greenblum & Bernstein, P.L.C.

Primary Examiner:

Coris Fung

Int. Cl.
CPC ...
B32B 27/38 (2006.01); C08G 59/50 (2006.01); H05K 1/03 (2006.01); C08G 8/28 (2006.01); C08J 5/24 (2006.01); C08G 71/04 (2006.01); C08K 3/36 (2006.01); C08K 5/098 (2006.01); B32B 15/14 (2006.01); B32B 5/02 (2006.01); B32B 15/20 (2006.01); D06M 15/564 (2006.01); D06M 101/00 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0373 (2013.01); B32B 5/024 (2013.01); B32B 15/14 (2013.01); B32B 15/20 (2013.01); C08G 8/28 (2013.01); C08G 71/04 (2013.01); C08J 5/24 (2013.01); C08K 3/36 (2013.01); C08K 5/098 (2013.01); D06M 15/564 (2013.01); B32B 2260/021 (2013.01); B32B 2260/046 (2013.01); B32B 2262/101 (2013.01); B32B 2307/202 (2013.01); B32B 2307/206 (2013.01); B32B 2457/08 (2013.01); C08J 2375/12 (2013.01); D06M 2101/00 (2013.01);
Abstract

A resin composition for a printed wiring board containing a cyanate compound (A); a maleimide compound (B); and a benzoguanamine compound (C) having an aminomethyl group represented by the following general formula (1): wherein R is a hydrogen atom or a substituent selected from a group consisting of a hydrocarbon group having 1 to 10 carbon atoms, an alkoxyl group having 1 to 10 carbon atoms, an aryloxy group having 6 to 10 carbon atoms, a hydroxyl group, an amide group, and a halogen atom, and n is an integer of 1 to 2.

Find Patent Forward Citations

Kobayashi, Takashi. (2018). Resin composition, prepreg, metal-foil-clad laminate, resin composite sheet, and printed wiring board (U.S. Patent No. 9974169). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9974169

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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