The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 15, 2018

Filed:

Dec. 16, 2016
Applicant:

Raytheon Company, Waltham, MA (US);

Inventors:

Christopher R. Koontz, Manhattan Beach, CA (US);

David M. Filgas, Newbury Park, CA (US);

Kurt S. Ketola, Los Angeles, CA (US);

Carl W. Townsend, Los Angeles, CA (US);

Assignee:

RAYTHEON COMPANY, Waltham, MA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G02B 6/10 (2006.01); H01S 3/063 (2006.01); H01S 3/04 (2006.01); H01S 3/094 (2006.01); H01S 3/16 (2006.01);
U.S. Cl.
CPC ...
H01S 3/0637 (2013.01); H01S 3/0405 (2013.01); H01S 3/094003 (2013.01); H01S 3/1643 (2013.01); H01S 3/161 (2013.01); H01S 3/1608 (2013.01); H01S 3/1611 (2013.01); H01S 3/1616 (2013.01); H01S 3/1618 (2013.01);
Abstract

An active optical planar waveguide apparatus includes a planar core layer comprising an active laser ion; one or more cladding layers in optical contact with at least one surface of the planar core layer; a metallic binder layer chemically bonded to an outermost cladding layer of the one or more cladding layers; a metallic adhesion layers disposed on the metallic binder layer; a heatsink for dissipating heat from the planar waveguide; and a metallic thermal interface material (TIM) layer providing a metallurgical bond between the metallic adhesion layer and the heatsink.


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