The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 15, 2018

Filed:

Sep. 03, 2014
Applicant:

Wistron Neweb Corp., Hsinchu, TW;

Inventors:

Tzu-Min Wu, Hsinchu, TW;

Yuan-Chin Hsu, Hsinchu, TW;

Assignee:

WISTRON NEWEB CORP., Hsinchu, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01Q 1/38 (2006.01); H01Q 7/06 (2006.01); H05K 3/18 (2006.01); H05K 3/42 (2006.01);
U.S. Cl.
CPC ...
H01Q 1/38 (2013.01); H01Q 7/06 (2013.01); H05K 3/182 (2013.01); H05K 3/422 (2013.01); H05K 2201/0195 (2013.01); H05K 2201/086 (2013.01); H05K 2201/10098 (2013.01); H05K 2203/073 (2013.01); H05K 2203/0709 (2013.01); Y10T 29/49016 (2015.01);
Abstract

A method for manufacturing an antenna includes the steps of: providing a ferrite sheet; forming a via hole through the ferrite sheet, wherein the via hole is connected between a first surface and a second surface of the ferrite sheet; forming a nonconductive ink layer on the first surface and the second surface and in the via hole of the ferrite sheet; applying a displacement process to the nonconductive ink layer so as to form a first metal layer on the nonconductive ink layer; and applying a thickening process to the first metal layer so as to form a second metal layer on the first metal layer, wherein the first metal layer and the second metal layer both extend from the first surface through the via hole to the second surface of the ferrite sheet.


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